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2SC2899 10032 TW0170A LLZ16V LF412MH BTP953L3 0002A01L VF10150C
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 2.0x1.2mm SMD CHIP LED LAMP
AP2012EC HIGH EFFICIENCY RED
Features
!2.0mmx1.2mm SMT LED, 1.1mm THICKNESS. !LOW POWER CONSUMPTION. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE
Description
The High Efficiency Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode.
: 2000PCS / REEL.
Package Dimensions
Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice.
SPEC NO: DSAA4049
REV NO: V.1
DATE: SEP/21/2001
PAGE: 1 OF 4
Selection Guide
Par t No .
Dic e
L en s Ty p e
Iv (m c d ) @ 20 m A Min . Ty p . 12
V i ew i n g An g l e 21/2 12 0
AP2012EC
HIGH EFFICIENCY RED(GaAsP/GaP)
WATER CLEAR
5
Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T)=25C
Sy m b o l peak D 1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength Spectral Line Halfwidth Capacitance Forward Voltage Reverse Current D ev i c e High Efficiency Red High Efficiency Red High Efficiency Red High Efficiency Red High Efficiency Red High Efficiency Red Ty p . 6 27 6 25 45 15 2.0 2.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s IF=20mA IF=20mA IF=20mA VF=0V;f=1MHz IF=20mA V R = 5V
Absolute Maximum Ratings at T)=25C
Par am et er Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating Temperature Storage Temperature
Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width.
H i g h E f f i c i e n c y r ed 10 5 30 160 5 -40C To +85C -40C To +85C
Un it s mW mA mA V
SPEC NO: DSAA4049
REV NO: V.1
DATE: SEP/21/2001
PAGE: 2 OF 4
High Efficiency Red AP2012EC
SPEC NO: DSAA4049
REV NO: V.1
DATE: SEP/21/2001
PAGE: 3 OF 4
AP2012EC SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process.
Recommended Soldering Pattern (Units : mm)
Tape Specifications (Units : mm)
SPEC NO: DSAA4049
REV NO: V.1
DATE: SEP/21/2001
PAGE: 4 OF 4


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